Linked by Thom Holwerda on Tue 25th Mar 2008 16:33 UTC, submitted by irbis
Oracle and SUN As computers chip continue to decrease in fabrication size, manufacturers such as AMD and Intel are researching new ways to overcome physical barriers. Die size, performance, operating frequency and heat are all major obstacles in the semiconductor industry. Sun Microsystems announced that in partnership with Luxtera, Kotura and Stanford University, it is working on an ambitions project to move data transmissions from electrical signals over copper wires to pulses of light using lasers.
Share this story

Your Name:

Your Email:

Your Friend's Email:

Please confirm the image:
Captcha