Linked by Thom Holwerda on Sun 19th Sep 2010 20:32 UTC, submitted by sawboss
Thread beginning with comment 441764
To view parent comment, click here.
To read all comments associated with this story, please click here.
To view parent comment, click here.
To read all comments associated with this story, please click here.
News
Linked by Thom Holwerda on 05/25/13 0:45 UTC
Linked by Thom Holwerda on 05/24/13 23:59 UTC
Linked by Thom Holwerda on 05/24/13 22:33 UTC
Linked by Howard Fosdick on 05/24/13 21:41 UTC
Linked by Thom Holwerda on 05/24/13 14:44 UTC
Linked by Thom Holwerda on 05/23/13 23:22 UTC
Linked by Thom Holwerda on 05/23/13 22:04 UTC
Linked by Thom Holwerda on 05/23/13 22:01 UTC
Linked by Thom Holwerda on 05/23/13 17:52 UTC
Linked by Thom Holwerda on 05/22/13 22:23 UTC
More News »
Sponsored Links



Member since:
2009-03-17
No, what you described is only a part of the binning process. Not all binning is done to increase yield by creating SKUs which can reuse parts which are not 100% compliant.
By the time a process is mature enough, most manufacturers will actually sell literally the same part at different speed/performance grades that have nothing to do with the functionality of the part and more to do with the specific price targets the manufacturer wants to hit.
For example, many SOC parts are now sold with specific sections/functionality of the chip disabled to meet price points for specific models. Even though, technically most of those SOCs are fully 100% functional. It is cheaper to do the disabling before the packaging stage than creating a new mask/fab line for a specific iteration of the SOC.