Linked by Thom Holwerda on Wed 11th Oct 2006 14:19 UTC, submitted by MaxxTotal
Hardware, Embedded Systems Sun Microsystems and Fujitsu engineers on Tuesday promised significant performance increases with two next-generation chips, models that they hope will help keep the Sparc line relevant. Company representatives speaking at the Fall Processor Forum promised significant gains over the chips' predecessors - the first Niagara (now called UltraSparc T1) and the single-core Sparc64 V.
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rayiner
Member since:
2005-07-06

Sparc64 leaves UltraSPARC in the dust. They are true OOO cores with both better IPC and higher clockspeed than Sun's UltraSPARC chips.

I don't know whether the system interconnect is any good, though.

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kaiwai Member since:
2005-07-06

Well, the TPC benchmarks demonstrate its performance pretty good - one assumes that database benchmarks are going to be bandwidth and latency sensitive.

I'd say that Sun will be using their own interconnect, with the SPARC VI sitting ontop; its their CPU that is crap, not the processor itself.

Edit: Mind you, IIRC, Sun is a member of Hypertransport consortium, so I'm assuming that when Hypertransport surpasses Suns own technology, they're going to use it - IIRC, Hypertransport 3.0 looks *really* good on paper, that would be a great combo; SPARC IV + Hypertransport 3.0.

Edited 2006-10-12 07:47

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drdoug Member since:
2006-04-30

I'd say that Sun will be using their own interconnect, with the SPARC VI sitting ontop; its their CPU that is crap, not the processor itself.

I thought both Sun and Fujitsu will co-marketing the Sparc64 VI in the APL systems developed by Fujitsu. The only difference probably will be the badges and possibly the colour of the plastic.

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